Burn-in Socket - Clamshell

Burn-in Socket - Clamshell Type

Test, validation or burn in test of IC devices

Package can be BGA, QFN, LGA, etc

Pitch can be as small as 0.35mm

Used for eMMC, eMCP, UFS, LPDDR, Nand, ePOP, etc...

 Burn-in Socket for Nand Flansh BGA132/BGA152                                                                                                                                                          

 Burn-in Socket for BGA153/BGA162/BGA221/BGA254/BGA100...                                                                                                                                                               

          eMMC BGA153 burn-in socket 701-0000050 drawing   

          eMMC BGA153 Burn-in Socket application                                       

• Clamshell test burn-in socket is designed for test, validation or burn-in test of IC devices like eMMC, eMCP, UFS, LPDDR, Nand, ePOP, etc...
  

• Patented structural rolling design with socket clamp makes it easy opeartion, less abrasion, so as to better socket life span.

• It is a product with very compact space and with good cost effectiveness, good quality, small and exquisite, meets most of your test applications.
  

• Customzied PCB board can be sold together with socket under customer's request.

  
  

Mechanical 

Material Socket Body：　              PEI

Material Socket Lid：　　              PEI

Contact：                                         Pogo Pin

Operation Temperature:　　        -40 ~ 125 ℃

Life Span:                                         20K ~ 30K Cycles

Spring Force:　                                20g ~ 40g per Pin

Electrical

Current Rating：　　                      1A

DC Resistance：                              Max. 100mΩ