Socket - Clamshell and Turning(CT) Suitable to device packcage of BGA, QFN, LGA, QFP, SOP,etc Clamshell & Turning vertical pressing Stability and Reliability |
| Mechanical Material Socket Body: PEEK Ceramic Material Socket Lid: AL, Cu, POM Contact: Pogo Pin Operation Temperature: -40 ~ 140 ℃ Life Span: 100K Cycles Spring Force: 20g ~ 40g per Pin Electrical Current Rating: 1A DC Resistance: Max. 100mΩ |
Part Number | Name | Description | Package | Pin Nb | Material | Remark |
---|---|---|---|---|---|---|
702-0000017 | Test Socket | BGA484 1.0mm NA CT 23x23mm | BGA | 484 | Peek Ceramic | |
702-0000025 | Test Socket | QFN48 0.4mm CT 6x6mm B | QFN | 48 | Peek Ceramic | |
702-0000143 | Test Socket | BGA1148 1.0mm NA CT 35x35mm | BGA | 1148 | Peek Ceramic | |
702-0000929 | Test Socket | BGA366 0.5mm LPDDR4 CT150 15x15mm | BGA | 366 | Peek Ceramic | |
702-0000731 | Test Socket | CSOP20 0.65mm SM3244 CT 5.45x7.35mm | SOP | 20 | Peek Ceramic |
Sireda provide CT socket for IC packeg of BGA, LGA, QFN, QFP, SOP,etc. Contact can be GCR, PCR or Pogo pin. More CT socket, please visit Clamshell and Turning Test Socket List