Lid removable Test Socket

Dual Latch and Turning (DT) Test Socket

Test, validation for IC devices of CPU, eMMC, eMCP, DDR, Nand

Package can be BGA, QFN, LGA, QFP, SOP, etc

Pitch can be as small as 0.35mm

Can be used for both manual test and automatic test

BGA134 socket.gif

DT test socket is designed for test, validation of IC devices like CPU, eMMC, eMCP, DDR, Nand Flash, etc.
Suitable for package of BGA, QFN, LGA, QFP, SOP, etc.
Vertical press operation makes it good stability and reliability.
Removable socket lid, socket can be used for both manual or automatic test.
Floating design makes good contact and protect devices from damage.
Provide customized socket design upon customer's specific requirements for proper socket material and pogo pins.

Mechanical

Material Socket Body：　 Torlon/PPS/PEEK Ceramic

Material Socket Lid：　　 AL/ POM

Contact： Pogo Pin

Operation Temperature:　　 -40 ~ 140 ℃

Life Span: 100K Cycles

Spring Force:　 20g ~ 30g per Pin

Electrical

Current Rating：　　 1A

DC Resistance： Max. 100mΩ

Part Number	Name	Description	Package	Pin Nb	Material
702-0000341	Test Socket	BGA100 0.4mm NA DT 2.35x8.33mm	BGA	100	Peek Ceramic
702-0000660	Test Socket	QFP144 0.65mm SM484245BR DT 26.02x26.02mm	QFP	144	Peek Ceramic
702-0000689	Test Socket	BGA153 0.5mm eMMC DT 11.5x13mm A	BGA	153	Peek Ceramic
702-0000908	Test Socket	BGA272 0.8mm NA DT125 14x18mm	BGA	272	Peek Ceramic
702-0000909	Test Socket	BGA200 0.65mm LPDDR4 DT125 14.5x11mm	BGA	200	Peek Ceramic

Sireda provides various DT socket for IC packages of BGA, LGA, QFN, QFP, SOP, etc. More DT socket, please visit Dual Latch and Turning (DT) Test Socket List. For more information, please contact sales@sireda.com

Dual Latch and Turning (DT) Test Socket

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