F Solution - Fast validation

F Solution

Test, Debug and validation of IC devices

Complete solution for fast validation

Pitch can be as small as 0.35mm

BGA153 UFS Tool.jpg

Sireda

F Solution is designed for fast validation & test of IC device.like eMMC,DRAM, eMCP, UFS, LPDDR3,LPDD4.
Patented Interposer design avoid problems of pad co-planarity oxidation and damage of PCB board after desoldering.
Innovation design of Interposer is compatible with different product. Device debug can start after solder the interposer on PCBA.
Provide signal access to the clock, strobe, data, address and command signals to the BGA package for making electrical and timing measurements with an Infiniium oscilloscope.
Provide direct signal access to BGA package for true compliance testing.
Customized interposer development.

Mechanical

Material Socket Body：　 Peek Ceramic

Material Socket Lid：　　 AL, Cu, POM

Contact： Pogo Pin

Operation Temperature:　　 -40 ~ 140 ℃

Life Span: 100K Cycles

Spring Force:　 20g ~ 30g per Pin

Electrical

Current Rating：　　 1.0A

DC Resistance： Max. 100mΩ

Part Number	Name	Description	Package	Pin Nb	Material
702-0000181	F Solution	BGA78 0.8mm DDR DT100 10.5x12mm F A	BGA	78	Peek Ceramic
702-0000159	F Solution	BGA153 0.5mm eMMC DT100 11.5x13mm F A	BGA	153	Peek Ceramic
702-0000250	F Solution	BGA84 0.8mm DDR DT100 8x13mm F	BGA	84	Peek Ceramic
702-0000266	F Solution	BGA95 0.65mm UFS DT100 11.5x13mm F A	BGA	95	Peek Ceramic
702-0000273	F Solution	BGA178 0.65mm LPDDR DT100 10.5x11.5mm F A	BGA	178	Peek Ceramic

Sireda provide full solution for IC device fast validation & debug. More F solution please visit F1 Solution Product List.

For customized Interposer, please contact sales@sireda.com.

F Solution - Fast validation tools