BGA芯片植球返修服务 |
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▲ 专注于高精密BGA返修 | ||
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深圳市斯纳达科技有限公司承接各种POP芯片返修(IC植球, 芯片植球), 公司拥有先进植球设备、BGA植球工艺和专业技术团队,专业解决客户POP返修难题和带黑胶芯片植球返修问题,提供IC返修一站式服务。
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▲ 高通芯片SM8350带黑胶芯片去胶植球举例:
(1) Bottom 面:去黑胶+植球 (2) Top 面:去黑胶+除锡
▲植球生产操作全流程,客户的需求不同,流程有部分差异。
▲ 典型的芯片植球
封装 | 间距 (mm) | 尺寸 (mm) | IC类型或型号 | 封装 | 间距 (mm) | 尺寸 (mm) | IC类型或型号 |
BGA558 | 0.4 | 11.0x11.4 | MT6765V | BGA78 | 0.8 | 8x13, 9x10.5, 9x11 | DDR3,DDR4 |
BGA575 | 0.4 | 10x10 | MSM8909W | BGA96 | 0.8 | 7.5x13.3, 7.5x13 | DDR3,DDR4 |
BGA747 | 0.4 | 14x14 | MSM8976 | BGA178 | 0.65 | 11x11.5 | LPDDR3, K4E8E304EE |
BGA771 | 0.35 | 10.5x11.1 | SDM710 | BGA200 | 0.65 | 10x14.5, 10x15 | LPDDR4 |
BGA809 | 0.35 | 10.5x11.1 | SM6250 | BGA256 | 0.4 | 14x14 | LPDDR3 |
BGA824 | 0.35 | 11.35x12.05 | MT6853 | BGA272 | 0.4 | 15x15 | LPDDR4 |
BGA837 | 0.35 | 12x12.4 | SM4350 | BGA296 | 0.35 | 14x14 | LPDDR3 |
BGA854 | 0.35 | 11.7x11.7 | MT6853V | BGA366 | 0.5 | 15x15 | LPDDR4, K3RG2G2 |
BGA857 | 0.4 | 14x14 | APQ8053 | BGA456 | 0.35 | 14x15.5 | LPDDR3 |
BGA893 | 0.35 | 12.4x12.4 | SM8150 | BGA496 | 0.4 | 12.4x14, 12.45x14.05 | LPDDR5 |
BGA945 | 0.35 | 11.1x12 | SM7250 | BGA556 | 0.4 | 12.4x12.4 | LPDDR4 |
BGA950 | 0.4 | 14x14 | MT6797 | BGA253 | 0.35 | 6.12x6.43 | SDR845 |
BGA977 | 0.35 | 12.4x12.4 | MT6885Z, MT6891, MT6893 | BGA302 | 0.35 | 6.0x7.01 | SDR8150 |
BGA1017 | 0.35 | 12.4x12.7 | SM8250 | BGA486 | 0.35 | 6.99x9.22 | SDR865 |
BGA1033 | 0.35 | 12.4x12.4 | MT6877V | BGA506 | 0.35 | 8.4x9.2 | SDX20 |
BGA1099 | 0.35 | 12.4x14.0 | SM8250 | BGA547 | 0.35 | 7.90x9.60 | SDX55M |
BGA1287 | 0.35 | 12x14 | SM7325 | BGA683 | 0.35 | 8.8x10.5 | SDX55 |
BGA1393 | 0.35 | 14x14.3 | SM8350 | BGA852 | 0.35 | 11.0x11.40 | SDX50M |
BGA1518 | 0.35 | 14x15 | SM8450 | BGA683 | 0.35 | 8.8x10.5 | SDX55 |
BGA136 | 0.5 | 10x10 | eMMC | BGA852 | 0.35 | 11.0x11.40 | SDX50M |
BGA153 | 0.5 | 11.5x13 | eMMC, UFS | BGA221 | 0.5 | 11.5x13 | eMCP |
BGA162 | 0.5 | 8x10.5 | eMCP | BGA254 | 0.5 | 11.5x13 | eMCP, uMCP, KM2V7001CM |
此处仅提供部分典型的芯片植球,我们可以根据客户的芯片开发植球治具和植球工艺,定制化植球。欢迎来询,或发邮件到sales@sireda.com。
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